Reel Service Ltd is the largest semiconductor, electro-mechanical and mechanical component finishing service and materials provider in Europe providing complete component solutions for device manufacturers, distributors, contract assembly providers and end users.

Services provided include SMD, axial and radial component Tape & Reel; wafer level CSP/Die processing including mounting to film frame, dicing, inspection and tape and reel or waffle packing, device programming, laser marking, bake & dry pack, component preparation, lead conditioning and re-tinning

Quality is our main focus in achieving customer satisfaction, achieved through zero defect policies, operational excellence, people and state-of-the-art equipment. The facility operates in accordance with ISO9001:2015 requirements.

Tape & Reel

Tape & Reel of:  Standard SMD Devices, Non-Standard Devices & Wafer Level/CSP


Bare Die Tape & Reel

Tape & Reel of Bare Die, Wafer Level Chip Scale Packages (CSP), Flip Chip & FR4 etc


Device Programming

Programming Service for MicroControllers, Flash, EEPROM, PLD etc


Laser Marking

Custom YAG & Fiber Laser Marking of Devices Supplied in Tray, Tube or Bulk/Loose Format


Bake & Dry Pack

Dehydration Bake & Vacuum Packaging Services


Component Preparation

Custom Lead Forming and Lead Straightening/Reforming to Customer Specifications