Services provided include Tape & Reel of standard outline SMD devices & Tape & Reel of non-standard devices connectors\etched parts\stampings etc ; wafer level CSP/Die processing including mounting to film frame, dicing, inspection and tape and reel or waffle packing; device programming, laser marking, bake & dry pack and component preparation, lead crop & form.
Quality is our main focus in achieving customer satisfaction, achieved through zero defect policies, operational excellence, people and state-of-the-art equipment. The facility operates in accordance with ISO9001:2015 requirements.
Tape & Reel of: Standard SMD Devices, Non-Standard Devices & Wafer Level/CSP
VIEWTape & Reel of Bare Die, Wafer Level Chip Scale Packages (CSP), Flip Chip & FR4 etc
VIEWProgramming Service for MicroControllers, Flash, EEPROM, PLD etc
VIEWCustom YAG & Fiber Laser Marking of Devices Supplied in Tray, Tube or Bulk/Loose Format
VIEWDehydration Bake & Vacuum Packaging Services
VIEWCustom Lead Forming and Lead Cropping to Customer Specifications
VIEW