The A-Z Glossary of Tape & Reel – Part 2 H to P

Manual Tape & Reel

The A-Z Glossary of Tape & Reel – Part 2 H to P

October 16, 2018

Continuing the Reel Service series ‘A-Z Glossary of Tape & Reel’, here in part 2 of 3 we cover letters H to P:

The A-Z Glossary of  Tape & Reel – H to P




  Hexa Tray based scanner for Leaded/Leadless, Ball Array packages & large form factor packages.  Class-leading inspection capability and high-speed output to tape & reel or tray.  The family of Hexa machines includes, Hexa Whizz, Hexa Sprint, Hexxa Maxx, Hexa Evo.
  Hub The central core of the reel which the tape is wound onto.  The reel hub diameter is determined by various factors including pocket depth and the type of component being packaged.
  Humidity The term used to describe the amount of water vapour present in the air.  A very important environmental parameter that must be controlled with the tape & reel production area.
  Humidity   Indicator Card Sometimes abbreviated to HIC, a small disposable card that uses uses coloured dots to indicate the Relative Humidity (RH) within a sealed storage cabinet, container or bag (see Moisture Barrier Bag).


  In-Pocket Inspection A vision system with a camera installed to view components in the tape pocket, can be pre-seal where any defects can be corrected before sealing, or post-seal where seal quality is inspected.
  Input Reel A reel containing empty carrier tape loaded onto a tape & reel machine.
  Interval Interval describes how often the tape & reel seal action operates, 1 = every pocket, 2 = every 2nd pocket etc
  ISO 2001:2015 Reel Service Ltd maintains compliance to the international Quality Management System standard of ISO 9001:2015
  iSort The iSort range of machines is an industry proven Die-Sorting platform providing accurate, high-speed die-sorting into tape & reel.  The family consists of iSort, duraSort, iSortMaxx, iSortExpress.


  JEDEC Joint Electron Device Engineering Council (JEDEC) is the technical voice of the semiconductor industry providing leadership in developing standards for a broad range of technologies.
  Jig A device used during a manufacturing or assembly process to provide repeatability, accuracy, and interchangeability.


  Kapton Label Kapton is a registered trademark of Du Pont for their version of a polyimide film which is widely used throughout industry.  For electronics applications, the film is used for masking applications due to its large range of temperature stability, and its electrical isolation ability.
  Kitting Kitting describes the steps involved in  organising, arranging and preparing materials required for final assembly or manufacture.
  Klik Reel A modular reel system comprising of different reel half sizes that when assembled together (Kliked) form a complete reel.  The modular system provides minimised shipping & storage volume before assembly with the added benefit of reducing the number of stock items needed to assemble the most common reel sizes.  Klik reel half’s are available in 4mm, 8mm, 16mm & 28mm, which can be combined into assembled reel widths of 8mm, 12mm, 16mm, 24mm, 32mm, 44mm & 56mm.
  Ko  ANSI/ISO/GDT drawing notation defining carrier tape pocket depth.


  Label An adhesive paper label applied to reels, boxes, bags etc providing information on the contents, typically part number, lot number, date of manufacture, stock code etc.
  Laser Marking A product identification and marking process used to apply a permanent identification onto a product.  Can be human readable text and images/logos and increasing in use are machine readable codes providing large data density in a very small area.  Laser marking is often favoured over pad printing due to its longevity & permanency due to it’s resistance to abrasion and chemicals etc.
  Lead An individual I/O point on electronic components with side terminations.  Leads can be straight, gull-wing or J-lead.
  Leader When components on tape & reel are unwound, the initial length of empty tape that that precedes filled pockets is termed leader.
  Length When applied to components, length describes the longest edge of a component.  when applied to tape, length describes the overall distance from end to end of the tape, typically denoted in meters.
  Loose A term that can be interchangeable with bulk, both terms are used to describe supply of components packaged and supplied loose, typically supplied in bags.


  Marking A process whereby identification is applied to components for identification, branding and traceability purpose.  Typical component marking processes are laser marking and ink/pad printing.
  Moisture Barrier Bag A pouch typically made from a layered film comprising layers of Aluminized Polyester, Dissipative Nylon, Cast Polyethlene, Aluminium Foil which combined together provide  a permeable film which allow little or no moisture transfer through the film materials.  Products are then vacuum packaged inside the Moisture Barrier Bag (MBB) providing a low cost, long term storage and transportation method within a controlled environment.


  Non-Flip A term typically used to describe pick and place of singulated die or other products from silicon wafers or substrates into tape & reel whereby the the die or substrate top face remains the top face when placed into the carrier tape pocket. i.e. the device is not flipped/inverted.


  Orientation A term used to describe how a component is placed into the carrier tape pocket.  Typically a mechanical feature or mark on the component is referenced to a tape pocket quadrant to define the in tape orientation.
  Output Reel The product of the tape & reel process, typically a reel containing carrier tape with filled pockets and sealed with cover tape.
  Oval Sprocket Hole Carrier tape tractor drive holes punched on the tape edge adjacent to the round sprocket holes, oval sprocket holes are used on 32mm wide carrier tape and above.  also referred to as elongated sprocket holes.


  Pad A flat  I/O interconnect point where no additional extended interconnect is attached (lead,ball, bump etc) used on package outlines such as DFN, QFN etc.
  Peel Strength   Test A destructive test process which evaluates the adhesion between cover tape and carrier tape typically measured in grams (gms) or newtons (N).
  Pick & Place A broad term which describes an automated process used for assembly or placement of components from one input media to another output media.  The term is most commonly associated with the assembly of PCBs where the output is placement onto the PCB.  Pick & Place, sometimes shortened to PnP  is also used during the tape & reel process where place (or output) is component placement into the carrier tape pocket.
  Pin 1 The term Pin 1 refers to I/O point No: 1 on a component and is typically marked on the component by a printed dot, laser marked dot, moulding indentation or edge chamfer.
  Pitch Pitch defines the spacing between component I/O points (leads, bumps, balls, pads).  Pitch is defined as the difference between the actual distance two adjacent leads are spaced apart and the nominal pitch dimension.
  Pizza Box A box, typically constructed from corrugated cardboard used to package and transport components packed onto tape & reel.
  Platform A carrier tape feature used to elevate the component from the base of the pocket to protect the (leads, bumps, balls pads) during transportation.
  PLCC Abbreviation for Plastic Leaded Chip Carrier, a standard JEDEC outline package which incorporates J-leads on all 4 sides of the package.
  Pocket A term that is interchangeable with ‘cavity’, a pocket describes each individual compartment on the carrier tape which is used to package and transport devices.
  Pressure  A key parameter used to control the effective Peel Strength adhesion value between cover tape & carrier tape, measured in PSI or bar.
  Punched Punching or cropping can describe how some leadless package outlines are singulated during assembly.
  Punching A process during carrier tape manufacture to  create sprocket holes and centre holes
  PVI Inspection PVI is an abbreviation for Package Visual Inspection, sometimes referred to as Package Quality Inspection.  PVI uses powerful automated vision inspection systems to inspect components for surface defects such as chips, cracks, scratches, contamination and accumulate black marks on white background or accumulate white marks on black background.


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