To maintain its position in new technology trends Reel Service Ltd introduced the ISORT, the very latest STI wafer level package processing equipment.

Since its introduction millions of wafer level devices have been taped and reeled for a wide range of industries from automotive, defence, aerospace, sensor, medical and cellphone.

Wafer level devices may be silicon, glass, ceramic or FR4 based. Die based products, chip scale packages and flip chip devices may be processed through a number of supporting processes for a holistic supply chain solution, for example:

The intricacies of small and fragile die has resulted in the development of MicroTape, a tape based presentation media providing complete protection for die in transit whilst maintaining very high speed placement compatibility .

Reel Service operates Class 10,000 cleanroom options for taping and reeling in protected environments.