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Products and Services
Tape & Reel Services
  SMD Tape & Reel
  Wafer Level Package Tape & Reel or Waffle Pack
  Axial and Radial Tape and Reel
  Lead Forming and Refurbishment
  Lead Conditioning/ Re-tinning
  Component Preparation
  Laser Marking
  Bake and Dry Pack
Device Programming
Materials
Equipment Sales
DataSheets and Tooling List

 

   
 
Tape & Reel Services
Tape and Reel Services We offer the following:
SMD Tape & Reel
Wafer Level CSP/Die Package Tape & Reel or Waffle Pack
Axial and Radial Tape & Reel
Lead Forming and Refurbishment
Lead Conditioning/Re-Trimming
Component Preparation
Laser Marking
Bake and Dry Pack
     
Our Taping & Reeling Services are supported by the manufacturing division of Reel Service where a range of carrier tapes are designed and manufactured from top quality, high specification base materials. Our in-house design expertise, custom tooling and material manufacturing capabilities ensure well defined, strong pocket formation including deep pocket forming.

State of the art, high-speed Tape & Reel equipment supports an annual capacity for tape & reel in excess of 200 million devices, providing users with unparalleled value chain solutions.

Specific processing requirements across the semiconductor and electronics business environment are addressed through strategic partnerships, attention to detail and transparency in information communication.

Devices can be received in a variety of formats: wafer, film frame, strip, tray, tube or loose. Semiconductors, electro-mechanical and mechanical devices ranging from legacy Pin Through Hole (PTH), Axial, Radial and Surface Mount Device (SMD) to Wafer Level CSP/Die Package can all be Taped & Reeled.
 
 
Our Affiliates:
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55 Nasmyth Road, Southfield Industrial Estate, Glenrothes, Fife KY6 2SD, Scotland, U.K.T (44) (1592) 773 208F (44) (1592) 774 696
 
 
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