MicroTape is a unique packing solution for all devices less than 1mm thick, such as Bare Die, Flip Chips, Micro BGA’s and Bumped Die. Manufactured to EIA-481 standard, it can be easily used with any standard tape & reel or pick and place equipment.

MicroTape is a punched carrier tape supplied with cover tape applied to one side. This can allow for testing of the device prior to sealing the top cover tape and both top and bottom side inspection after placement and sealing. The vertical sides of the punched aperture prevent the device from riding up the walls (as in some embossed tapes) and the tightly controlled aperture relative to the die size minimises abrasion and difficulty in accurate pick up of the device.