AIM also manufacture MicroTape, a total packaging solution for all devices less than 1.5mm thick such as Bare Die, Flip Chips, Micro BGAs and Bumped Die. Manufactured to EIA-481-B standards with regards to tape width, pitch, thickness and sprocket hole dimensions it can easily be used with any standard tape & reeling or pick & place mechanisms.
With our in-house design expertise, custom tooling and material manufacturing capabilities, if your exact requirements are not currently available a new tape can be produced to your specifications within a short space of time. Please contact our Customer Service Department for further details. |