Components are screened using automatic lead scanning systems to determine good and damaged components. Defective devices requiring lead conditioning have their leads carefully combed and reformed. Optional processes include re-tinning in native solder or conversion from leaded to lead free solder.

Before Lead Conditioning

All devices processes are contained with ESD safe environments to maintain integrity. As a final process check leads are scanned to verify the success of the lead conditioning process before packaging in carrier tape, trays or tubes and despatch world-wide.

After Lead Conditioning