Sensitive electronic components packaged in moisture-permeable materials, such as plastic, can succumb to the effects of moisture ingress. When exposed to elevated temperatures, for example those experienced during reflow soldering, moisture trapped inside can expand and produce enough vapour to damage or destroy the device. Commonly seen failures include internal separation (delaminating) of the plastic from the die or lead-frame; wire bond damage; die damage; and internal cracks. In extreme cases, the component will bulge and pop (often referred to as the "popcorn" effect).

Reel Service offer a bake procedure which removes the moisture from these vulnerable devices. Our regularly maintained and calibrated ovens give us the consistent performance and capacity to meet our customers’ needs. A bake can be carried out to Reel Service Standard or can be customer specified.

To maintain the dry condition of the components after baking they are hermetically sealed under vacuum in a Moisture Barrier Bag (MBB). A desiccant bag and Humidity Indicator Card (HIC) are placed in the MBB before sealing to maintain and indicate the condition of the product for the end user. The shelf life of product packaged in this manner is typically 1 year.